S29GL064A11BAIW33
vs
S29GL064M11FAIR52
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
FBGA-64
LBGA, BGA64,8X8,40
Pin Count
64
64
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Boot Block
TOP
TOP
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e0
e0
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
2
Additional Feature
TOP BOOT BLOCK
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Length
13 mm
Moisture Sensitivity Level
3
Number of Sectors/Size
128
Package Equivalence Code
BGA64,8X8,40
Page Size
4 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Seated Height-Max
1.4 mm
Sector Size
32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.06 mA
Terminal Pitch
1 mm
Toggle Bit
YES
Width
11 mm
Compare S29GL064A11BAIW33 with alternatives
Compare S29GL064M11FAIR52 with alternatives