S29GL032N90TFI13 vs AM29LV320MH90REI feature comparison

S29GL032N90TFI13 Cypress Semiconductor

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AM29LV320MH90REI Spansion

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description TSSOP, MO-142EC, TSOP-56
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e3 e0
Length 18.4 mm 18.4 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 14 mm 14 mm
Base Number Matches 2 2
Part Package Code TSOP1
Pin Count 56
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 64
Package Equivalence Code TSSOP56,.8,20
Page Size 4/8 words
Peak Reflow Temperature (Cel) 260
Ready/Busy YES
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.08 mA
Toggle Bit YES
Type NOR TYPE

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