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S29GL032N90DFI30 vs S29GL032N90DFI33 feature comparison

S29GL032N90DFI30 Cypress Semiconductor

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S29GL032N90DFI33 Spansion

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description 9 X 9 MM, LEAD FREE, FBGA-64 9 X 9 MM, LEAD FREE, FBGA-64
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code S-PBGA-B64 S-PBGA-B64
Length 9 mm 9 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 9 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 64
Memory » Flash Memories
Memory » Flash Memories

Compare S29GL032N90DFI30 with alternatives

Compare S29GL032N90DFI33 with alternatives