S29GL032N90DFI020
vs
S29GL032N90DFI010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SPANSION INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
Length
9 mm
9 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
64
64
Number of Terminals
64
64
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
8/16 words
8/16 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
64K
64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
9 mm
9 mm
Base Number Matches
3
2
Part Package Code
BGA
Package Description
9 X 9 MM, LEAD FREE, FBGA-64
Pin Count
64
Compare S29GL032N90DFI020 with alternatives
Compare S29GL032N90DFI010 with alternatives