S29GL032N90BAI033 vs M29W320DT90ZE1F feature comparison

S29GL032N90BAI033 Spansion

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M29W320DT90ZE1F Micron Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description 8.15 X 6.15 MM, FBGA-48 FBGA, BGA48,6X8,32
Pin Count 48
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
Boot Block TOP TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 8.15 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 8,63 1,2,1,63
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA FBGA
Package Equivalence Code BGA48,6X8,32 BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Page Size 8/16 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1 mm
Sector Size 8K,64K 16K,8K,32K,64K
Standby Current-Max 0.000005 A 0.0001 A
Supply Current-Max 0.05 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 6.15 mm
Base Number Matches 2 3

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