S29GL032N70FFI20
vs
M28W320FSU70ZA6F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
13 X 11 MM, LEAD FREE, FBGA-64
10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
Pin Count
64
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e1
e1
Length
13 mm
13 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Current-Max
0.05 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
10 mm
Base Number Matches
1
2
Additional Feature
100,000 PROGRAM/ERASE CYCLES
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
Number of Sectors/Size
32
Package Equivalence Code
BGA64,8X8,40
Sector Size
64K
Standby Current-Max
0.00005 A
Toggle Bit
NO
Compare S29GL032N70FFI20 with alternatives
Compare M28W320FSU70ZA6F with alternatives