S29GL032M90TFCR23
vs
S29GL032A90TFIR22
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Package Description
TSSOP, TSSOP56,.8,20
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Sectors/Size
64
64
Number of Terminals
56
56
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP56,.8,20
TSSOP56,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size
4/8 words
4/8 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
64K
64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.06 mA
0.06 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Supply Voltage-Nom (Vsup)
3.3 V
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40