S29GL032A90TFIR22 vs S29GL032M90TFCR23 feature comparison

S29GL032A90TFIR22 Cypress Semiconductor

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S29GL032M90TFCR23 AMD

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e3
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Sectors/Size 64 64
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP56,.8,20 TSSOP56,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 4/8 words 4/8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 64K 64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 2 2
Package Description TSSOP, TSSOP56,.8,20