S29GL01GS11DHI023
vs
S29GL01GS11FHI013
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
Package Description
LBGA, BGA64,8X8,40
LBGA, BGA64,8X8,40
Pin Count
64
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.1.A
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
S-PBGA-B64
R-PBGA-B64
Length
9 mm
13 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
EEPROM CARD
Memory Width
8
16
Number of Functions
1
1
Number of Sectors/Size
1K
1K
Number of Terminals
64
64
Number of Words
134217728 words
67108864 words
Number of Words Code
128000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128MX8
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
16 words
16 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
64K
64K
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
9 mm
11 mm
Base Number Matches
2
2
Pbfree Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
TIN SILVER COPPER
Compare S29GL01GS11DHI023 with alternatives
Compare S29GL01GS11FHI013 with alternatives