S29GL01GP13TFI020
vs
S29GL01GP13TFI023
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SPANSION INC
Package Description
20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
HTSSOP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
130 ns
130 ns
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
Length
18.4 mm
18.4 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
1073741824 words
1073741824 words
Number of Words Code
1000000000
1000000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1GX1
1GX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HTSSOP
HTSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
14 mm
14 mm
Base Number Matches
2
2
Part Package Code
TSOP1
Pin Count
56
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