S29GL01GP13FFI010
vs
S29GL01GP13FFIV23
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
LBGA,
LBGA, BGA64,8X8,40
Pin Count
64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
130 ns
130 ns
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
1073741824 words
134217728 words
Number of Words Code
1000000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1GX1
128MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
2
2
Rohs Code
Alternate Memory Width
1
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Sectors/Size
1K
Package Equivalence Code
BGA64,8X8,40
Page Size
8/16 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
128K
Standby Current-Max
0.000005 A
Supply Current-Max
0.11 mA
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
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