S29GL01GP13FAIR20
vs
K8S1115EZC-SC1F0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Package Description
13 X 11 MM, 1 MM PITCH, FBGA-64
VFBGA, BGA64,10X14,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
130 ns
100 ns
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
Memory Density
1073741824 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
1073741824 words
33554432 words
Number of Words Code
1000000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1GX1
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1 mm
Supply Current-Max
0.11 mA
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
3 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
64
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
512
Package Equivalence Code
BGA64,10X14,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Sector Size
64K
Standby Current-Max
0.00003 A
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
YES
Compare S29GL01GP13FAIR20 with alternatives
Compare K8S1115EZC-SC1F0 with alternatives