S29CL016J0PFFI000
vs
S29CL016J0MFAN002
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
Package Description |
LBGA, BGA80,8X10,40
|
LBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
54 ns
|
54 ns
|
Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
|
Boot Block |
TOP
|
TOP
|
Command User Interface |
YES
|
|
Common Flash Interface |
YES
|
|
Data Polling |
YES
|
|
JESD-30 Code |
R-PBGA-B80
|
R-PBGA-B80
|
JESD-609 Code |
e1
|
|
Length |
13 mm
|
13 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
32
|
32
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
16,30
|
|
Number of Terminals |
80
|
80
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX32
|
512KX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA80,8X10,40
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3.3 V
|
3.3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Sector Size |
2K,16K
|
|
Standby Current-Max |
0.00006 A
|
|
Supply Current-Max |
0.09 mA
|
0.09 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Toggle Bit |
YES
|
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
80
|
|
|
|
Compare S29CL016J0PFFI000 with alternatives
Compare S29CL016J0MFAN002 with alternatives