S29CD016J1MQFM122
vs
S29CD016J1JQAI112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
QFP,
PLASTIC, MO-108CB-1, QFP-80
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
54 ns
54 ns
Boot Block
TOP
BOTTOM
JESD-30 Code
R-PQFP-G80
R-PQFP-G80
JESD-609 Code
e3
e0
Length
20 mm
20 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
32
32
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
80
80
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX32
512KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.35 mm
3.35 mm
Supply Current-Max
0.06 mA
0.09 mA
Supply Voltage-Max (Vsup)
2.75 V
2.75 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Type
NOR TYPE
NOR TYPE
Width
14 mm
14 mm
Base Number Matches
2
2
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
16,30
Package Equivalence Code
QFP80,.7X.9,32
Ready/Busy
YES
Sector Size
2K,16K
Standby Current-Max
0.00006 A
Toggle Bit
YES
Compare S29CD016J1MQFM122 with alternatives
Compare S29CD016J1JQAI112 with alternatives