S29CD016J1JQAN003
vs
S29CD016J1JQAN002
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
QFP,
|
Pin Count |
80
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
54 ns
|
54 ns
|
Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
|
Boot Block |
TOP
|
TOP
|
JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
JESD-609 Code |
e0
|
e0
|
Length |
20 mm
|
20 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
80
|
80
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX32
|
512KX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
2.7 V
|
2.7 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.35 mm
|
3.35 mm
|
Supply Current-Max |
0.09 mA
|
0.09 mA
|
Supply Voltage-Max (Vsup) |
2.75 V
|
2.75 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
2.6 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare S29CD016J1JQAN003 with alternatives
Compare S29CD016J1JQAN002 with alternatives