S29CD016J0JQAI022
vs
S29CD016G0PQAN003
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Package Description
PLASTIC, MO-108CB-1, QFP-80
,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
54 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
TOP
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PQFP-G80
JESD-609 Code
e0
Length
20 mm
Memory Density
16777216 bit
Memory IC Type
FLASH
Memory Width
32
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
16,30
Number of Terminals
80
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX32
Package Body Material
PLASTIC/EPOXY
Package Code
QFP
Package Equivalence Code
QFP80,.7X.9,32
Package Shape
RECTANGULAR
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
3.35 mm
Sector Size
2K,16K
Standby Current-Max
0.00006 A
Supply Current-Max
0.09 mA
Supply Voltage-Max (Vsup)
2.75 V
Supply Voltage-Min (Vsup)
2.5 V
Supply Voltage-Nom (Vsup)
2.6 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.8 mm
Terminal Position
QUAD
Toggle Bit
YES
Type
NOR TYPE
Width
14 mm
Base Number Matches
2
2
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