S29CD016G0MDGH014
vs
S29CD016G0JDGI014
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
7.44 X 4.46 MM, DIE-76
|
7.44 X 4.46 MM, DIE-76
|
| Pin Count |
76
|
76
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.A
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
64 ns
|
67 ns
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-XUUC-N76
|
R-XUUC-N76
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
76
|
76
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
145 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX32
|
512KX32
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
2.75 V
|
2.75 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
2.6 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare S29CD016G0MDGH014 with alternatives
Compare S29CD016G0JDGI014 with alternatives