S29AS008J70BFI022 vs S29AS008J70BFI020 feature comparison

S29AS008J70BFI022 Spansion

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S29AS008J70BFI020 Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer SPANSION INC INFINEON TECHNOLOGIES AG
Package Description FBGA, BGA48,6X8,32
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Sectors/Size 8,15 8,15
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA48,6X8,32 BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 8K,64K 8K,64K
Standby Current-Max 0.00003 A 0.00003 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 2 3
Samacsys Manufacturer Infineon

Compare S29AS008J70BFI022 with alternatives

Compare S29AS008J70BFI020 with alternatives