S29AS008J70BFI022
vs
S29AS008J70BFI020
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
SPANSION INC
|
INFINEON TECHNOLOGIES AG
|
Package Description |
FBGA, BGA48,6X8,32
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Access Time-Max |
70 ns
|
70 ns
|
Alternate Memory Width |
8
|
8
|
Boot Block |
BOTTOM
|
BOTTOM
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Sectors/Size |
8,15
|
8,15
|
Number of Terminals |
48
|
48
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX16
|
512KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
1.8 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Sector Size |
8K,64K
|
8K,64K
|
Standby Current-Max |
0.00003 A
|
0.00003 A
|
Supply Current-Max |
0.03 mA
|
0.03 mA
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
2
|
3
|
Samacsys Manufacturer |
|
Infineon
|
|
|
|
Compare S29AS008J70BFI022 with alternatives
Compare S29AS008J70BFI020 with alternatives