S29AL016J70BAI010 vs S29AL016J70BHN012 feature comparison

S29AL016J70BAI010 Infineon Technologies AG

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S29AL016J70BHN012 Spansion

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Rohs Code No
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG SPANSION INC
Package Description 8.15 X 6.15 MM, 0.80 MM PITCH, FPBGA-48 ,
Reach Compliance Code compliant unknown
Samacsys Manufacturer Infineon
Access Time-Max 70 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B48
Length 8.15 mm
Memory Density 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 3 V
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6.15 mm
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.32.00.51

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