S29AL016J55BFIR22
vs
24LC16BI/SL
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
SPANSION INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
|
0.150 INCH, PLASTIC, SOIC-14
|
Pin Count |
48
|
14
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Access Time-Max |
55 ns
|
|
Additional Feature |
BOTTOM BOOT BLOCK
|
|
Alternate Memory Width |
8
|
|
Boot Block |
BOTTOM
|
|
Command User Interface |
YES
|
|
Common Flash Interface |
YES
|
|
Data Polling |
YES
|
|
JESD-30 Code |
R-PBGA-B48
|
R-PDSO-G14
|
JESD-609 Code |
e1
|
e3
|
Length |
8.15 mm
|
9.271 mm
|
Memory Density |
16777216 bit
|
16384 bit
|
Memory IC Type |
FLASH
|
EEPROM
|
Memory Width |
16
|
8
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
1,2,1,31
|
|
Number of Terminals |
48
|
14
|
Number of Words |
1048576 words
|
2048 words
|
Number of Words Code |
1000000
|
2000
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1MX16
|
2KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOP
|
Package Equivalence Code |
BGA48,6X8,32
|
SOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programming Voltage |
3 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1 mm
|
1.728 mm
|
Sector Size |
16K,8K,32K,64K
|
|
Standby Current-Max |
0.000005 A
|
0.00003 A
|
Supply Current-Max |
0.03 mA
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Toggle Bit |
YES
|
|
Type |
NOR TYPE
|
|
Width |
6.15 mm
|
3.9 mm
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
Yes
|
Clock Frequency-Max (fCLK) |
|
0.1 MHz
|
Data Retention Time-Min |
|
200
|
Endurance |
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
|
1010MMMR
|
Output Characteristics |
|
OPEN-DRAIN
|
Power Supplies |
|
3/5 V
|
Serial Bus Type |
|
I2C
|
Write Cycle Time-Max (tWC) |
|
10 ms
|
Write Protection |
|
HARDWARE
|
|
|
|
Compare S29AL016J55BFIR22 with alternatives
Compare 24LC16BI/SL with alternatives