S29AL008J70BFI013
vs
AM29F016-150SCB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
|
SOP-44
|
Pin Count |
48
|
44
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
70 ns
|
150 ns
|
Additional Feature |
TOP BOOT BLOCK
|
|
Alternate Memory Width |
8
|
|
Boot Block |
TOP
|
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
R-PBGA-B48
|
R-PDSO-G44
|
JESD-609 Code |
e1
|
e0
|
Length |
8.15 mm
|
28.2 mm
|
Memory Density |
8388608 bit
|
16777216 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
1,2,1,15
|
32
|
Number of Terminals |
48
|
44
|
Number of Words |
524288 words
|
2097152 words
|
Number of Words Code |
512000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX16
|
2MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOP
|
Package Equivalence Code |
BGA48,6X8,32
|
SOP44,.63
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3 V
|
5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1 mm
|
2.8 mm
|
Sector Size |
8K,4K,16K,32K
|
64K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.012 mA
|
0.04 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
6.15 mm
|
13.3 mm
|
Base Number Matches |
1
|
1
|
Output Characteristics |
|
3-STATE
|
|
|
|
Compare S29AL008J70BFI013 with alternatives
Compare AM29F016-150SCB with alternatives