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S29AL008D70DHE14 vs S29AL008D70WHV29 feature comparison

S29AL008D70DHE14 Spansion

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S29AL008D70WHV29 Spansion

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code DIE WAFER
Package Description 3.90 X 3.05 MM, DIE-44 3.90 X 3.05 MM, WAFER-44
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
JESD-30 Code R-XUUC-N44 R-XUUC-N44
JESD-609 Code e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 512KX16 512KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 1 1
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL
Memory » Flash Memories
Memory » Flash Memories

Compare S29AL008D70DHE14 with alternatives

Compare S29AL008D70WHV29 with alternatives