S25FL256LAGBHN023 vs S25FL256LAGBHM023 feature comparison

S25FL256LAGBHN023 Infineon Technologies AG

Buy Now Datasheet

S25FL256LAGBHM023 Infineon Technologies AG

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG INFINEON TECHNOLOGIES AG
Package Description FBGA-24 BGA-24
Reach Compliance Code compliant compliant
Additional Feature IT ALSO HAVE MEMORY WIDTH X 1
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
JESD-30 Code R-PBGA-B24 R-PBGA-B24
Length 8 mm 8 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32MX8 32MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Infineon
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Moisture Sensitivity Level 3
Package Equivalence Code BGA24,5X5,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Serial Bus Type SPI
Standby Current-Max 0.00006 A
Supply Current-Max 0.05 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Protection HARDWARE/SOFTWARE

Compare S25FL256LAGBHN023 with alternatives

Compare S25FL256LAGBHM023 with alternatives