S25FL164K0XBHI023 vs S25FL032P0XMFI001 feature comparison

S25FL164K0XBHI023 Spansion

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S25FL032P0XMFI001 Cypress Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Package Description 8 X 6 MM, 1 MM PITCH, GREEN, BGA-24 SOP-16
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature ALSO CONFIGURABLE AS 64M X 1
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 108 MHz 104 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24 R-PDSO-N16
JESD-609 Code e1
Length 8 mm 10.3 mm
Memory Density 67108864 bit 65536 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 16
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 4MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SON
Package Equivalence Code BGA24,5X5,40 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.65 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000005 A 0.00001 A
Supply Current-Max 0.025 mA 0.038 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL NO LEAD
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 7.5 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 3 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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