S25FL129P0XBHI210
vs
S25FL129P0XBHI303
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
BGA
|
|
Package Description |
6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24
|
BGA-24
|
Pin Count |
24
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.1.A
|
|
HTS Code |
8542.32.00.51
|
|
Clock Frequency-Max (fCLK) |
104 MHz
|
104 MHz
|
Data Retention Time-Min |
20
|
20
|
Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
JESD-30 Code |
R-PBGA-B24
|
R-PBGA-B24
|
Length |
8 mm
|
8 mm
|
Memory Density |
134217728 bit
|
134217728 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
16MX8
|
16MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TBGA
|
TBGA
|
Package Equivalence Code |
BGA24,5X5,40
|
BGA24,4X6,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Serial Bus Type |
SPI
|
SPI
|
Standby Current-Max |
0.00001 A
|
0.00001 A
|
Supply Current-Max |
0.038 mA
|
0.038 mA
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
6 mm
|
6 mm
|
Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE/SOFTWARE
|
Base Number Matches |
2
|
3
|
Output Characteristics |
|
3-STATE
|
Write Cycle Time-Max (tWC) |
|
50 ms
|
|
|
|
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