S25FL128LAGBHI030
vs
S25FL128LAGBHM020
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
IT ALSO HAVE MEMORY WIDTH X 1
IT ALSO HAVE MEMORY WIDTH X 1
Alternate Memory Width
2
2
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
JESD-30 Code
R-PBGA-B24
R-PBGA-B24
Length
8 mm
8 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX8
16MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA24,5X5,40
BGA24,5X5,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Programming Voltage
3 V
3 V
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
2
2
Date Of Intro
2016-09-26
Screening Level
AEC-Q100