S25FL064P0XMFV003
vs
W25X64-VSFI-G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16
SOP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
33 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e3
Length
10.3 mm
10.285 mm
Memory Density
67108864 bit
64094208 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
8388608 words
64094208 words
Number of Words Code
8000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
64MX1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.64 mm
Serial Bus Type
QSPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.038 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Type
NOR TYPE
Width
7.5 mm
7.49 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
2
Compare S25FL064P0XMFV003 with alternatives
Compare W25X64-VSFI-G with alternatives