S25FL064P0XBHV023
vs
S25FL064P0XBHI023
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
VBGA, BGA24,5X5,40
6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24
Pin Count
24
24
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
104 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PBGA-B24
Length
8 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBGA
VBGA
Package Equivalence Code
BGA24,5X5,40
BGA24,5X5,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Serial Bus Type
QSPI
QSPI
Standby Current-Max
0.00001 A
0.00001 A
Supply Current-Max
0.038 mA
0.038 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.2 mm
1.2 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
2
3
Compare S25FL064P0XBHV023 with alternatives
Compare S25FL064P0XBHI023 with alternatives