S25FL064LABMFI013
vs
S25FL064LABMFI010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
SOIC-8
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2016-09-26
2016-09-26
Additional Feature
IT ALSO HAVE X1 MEMORY WIDTH
IT ALSO HAVE X1 MEMORY WIDTH
Alternate Memory Width
2
2
Clock Frequency-Max (fCLK)
108 MHz
108 MHz
JESD-30 Code
S-PDSO-G8
S-PDSO-G8
JESD-609 Code
e3
e3
Length
5.28 mm
5.28 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Programming Voltage
3 V
3 V
Seated Height-Max
2.16 mm
2.16 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.28 mm
5.28 mm
Base Number Matches
2
2
Compare S25FL064LABMFI013 with alternatives
Compare S25FL064LABMFI010 with alternatives