S25FL032P0XNFV011
vs
93AA66A-I/MNY
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SPANSION INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SON
|
DFN
|
| Package Description |
HVSON, SOLCC8,.25
|
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.1.A
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
1 MHz
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| Length |
8 mm
|
3 mm
|
| Memory Density |
33554432 bit
|
4096 bit
|
| Memory IC Type |
FLASH
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
4194304 words
|
512 words
|
| Number of Words Code |
4000000
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
4MX8
|
512X8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Serial Bus Type |
QSPI
|
MICROWIRE
|
| Standby Current-Max |
0.00001 A
|
|
| Supply Current-Max |
0.038 mA
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Type |
NOR TYPE
|
|
| Width |
6 mm
|
2 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e4
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Write Cycle Time-Max (tWC) |
|
6 ms
|
|
|
|
Compare S25FL032P0XNFV011 with alternatives
Compare 93AA66A-I/MNY with alternatives