S25FL032P0XBHI020 vs M25PX32SOVZM3T feature comparison

S25FL032P0XBHI020 Spansion

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M25PX32SOVZM3T Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description 8 X 6 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 6 X 8 MM, ROHS COMPLIANT, TBGA-24
Pin Count 24
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Spansion
Clock Frequency-Max (fCLK) 104 MHz 75 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24 R-PBGA-B24
Length 8 mm 8 mm
Memory Density 65536 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX8 4MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.038 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE
Width 6 mm 6 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 2

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Compare M25PX32SOVZM3T with alternatives