S25FL016M0LMAI001 vs NX25P16VFIG feature comparison

S25FL016M0LMAI001 Spansion

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NX25P16VFIG Winbond Electronics Corp

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 25 MHz
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e3
Length 10.3 mm 10.285 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.64 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 7.5 mm 7.49 mm
Base Number Matches 1 1
Pbfree Code Yes
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Moisture Sensitivity Level 3
Package Equivalence Code SOP16,.4
Serial Bus Type SPI
Standby Current-Max 0.000005 A
Write Protection HARDWARE/SOFTWARE

Compare S25FL016M0LMAI001 with alternatives

Compare NX25P16VFIG with alternatives