S25FL008A0LNFI001 vs XC17128LPD8C feature comparison

S25FL008A0LNFI001 Spansion

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XC17128LPD8C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC XILINX INC
Part Package Code SON DIP
Package Description VSON, SOLCC8,.25 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 10 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 R-PDIP-T8
JESD-609 Code e3 e0
Length 6 mm 9.3599 mm
Memory Density 8388608 bit 131072 bit
Memory IC Type FLASH CONFIGURATION MEMORY
Memory Width 8 1
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 131072 words
Number of Words Code 1000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 128KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON DIP
Package Equivalence Code SOLCC8,.25 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 225
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.55 mm 4.5974 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A 0.00005 A
Supply Current-Max 0.024 mA 0.005 mA
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 2.7 V 4.75 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Type NOR TYPE
Width 5 mm 7.62 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1
I/O Type COMMON

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