S2512CUY825K30
vs
H2512CUC825K30-W
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e4
e4
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.58 mm
0.58 mm
Package Length
6.35 mm
6.35 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.02 mm
3.02 mm
Packing Method
BULK
Waffle Pack
Rated Power Dissipation (P)
1.5 W
1.5 W
Rated Temperature
70 °C
Resistance
8200000 Ω
8200000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2512
2512
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Silver (Ag) - with Nickel (Ni) barrier
Silver (Ag)
Terminal Shape
WRAPAROUND
Tolerance
10%
10%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Compare S2512CUY825K30 with alternatives
Compare H2512CUC825K30-W with alternatives