S2009TB vs FMM4012KA feature comparison

S2009TB Rochester Electronics LLC

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FMM4012KA FUJITSU Limited

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC FUJITSU LTD
Part Package Code BGA QFP
Package Description 23 X 23 MM, COMPACT, TBGA-208 HQFP,
Pin Count 208 64
Reach Compliance Code unknown unknown
JESD-30 Code S-PBGA-B208 S-PQFP-G64
Length 23 mm 14 mm
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 1 1
Number of Terminals 208 64
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA HQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE FLATPACK, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.65 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish NOT SPECIFIED
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm 14 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Supply Current-Max 320 mA

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