S1M1V045B0J7 vs HY62QF16400LLM-10I feature comparison

S1M1V045B0J7 Epson Electronics America Inc

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HY62QF16400LLM-10I SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEIKO EPSON CORP SK HYNIX INC
Part Package Code BGA BGA
Package Description VFBGA, BGA48,6X8,30 TFBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 100 ns
Alternate Memory Width 8
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 11.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 256KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.11 mm
Standby Voltage-Min 1.2 V
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3 V 2.8 V
Supply Voltage-Min (Vsup) 2.4 V 2.2 V
Supply Voltage-Nom (Vsup) 2.7 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 10 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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Compare HY62QF16400LLM-10I with alternatives