S1206CA1893BEB-TR
vs
H1206CA1893BEW-W
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Package Description
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Additional Feature
PRECISION, REFERENCE STANDARD: MIL-PRF-55342
Construction
Chip
Chip
JESD-609 Code
e0
e4
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.38 mm
0.38 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.55 mm
1.55 mm
Packing Method
TR
Waffle Pack
Rated Power Dissipation (P)
0.3 W
0.3 W
Rated Temperature
70 °C
Resistance
189000 Ω
189000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Gold (Au)
Terminal Shape
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
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