S0603CPY8664F30
vs
H0603CPY8664F30-W
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e4
e4
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.46 mm
0.46 mm
Package Length
1.58 mm
1.58 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.81 mm
0.81 mm
Packing Method
BULK
Waffle Pack
Rated Power Dissipation (P)
0.1 W
0.1 W
Rated Temperature
70 °C
Resistance
8660000 Ω
8660000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Silver (Ag) - with Nickel (Ni) barrier
Silver (Ag) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
1%
Working Voltage
45 V
45 V
Base Number Matches
1
1
Compare S0603CPY8664F30 with alternatives
Compare H0603CPY8664F30-W with alternatives