S0402CUG101K30
vs
S0402CPX101K30-W
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e4
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Height |
0.46 mm
|
0.46 mm
|
Package Length |
1.07 mm
|
1.07 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.56 mm
|
0.56 mm
|
Packing Method |
Bulk
|
Waffle Pack
|
Rated Power Dissipation (P) |
0.05 W
|
0.05 W
|
Resistance |
100 Ω
|
100 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
0402
|
0402
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tolerance |
10%
|
10%
|
Working Voltage |
30 V
|
30 V
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
|
|
|
Compare S0402CUG101K30 with alternatives
Compare S0402CPX101K30-W with alternatives