S0402CPX23R7F30-W vs H0402CPY23R7F30-TR feature comparison

S0402CPX23R7F30-W State of the Art Inc

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H0402CPY23R7F30-TR State of the Art Inc

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e0 e4
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.46 mm 0.46 mm
Package Length 1.07 mm 1.07 mm
Package Style SMT SMT
Package Width 0.56 mm 0.56 mm
Packing Method Waffle Pack TR
Rated Power Dissipation (P) 0.05 W 0.05 W
Resistance 23.7 Ω 23.7 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 300 ppm/°C 300 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Silver (Ag) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 30 V 30 V
Base Number Matches 1 1

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