S-93C56ADP-1AG vs M93C56-RBN6T feature comparison

S-93C56ADP-1AG ABLIC Inc.

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M93C56-RBN6T STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEIKO INSTRUMENTS USA INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature DATA RETENTION: 10 YEARS
Clock Frequency-Max (fCLK) 2 MHz 1 MHz
Data Retention Time-Min 10
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.6 mm 9.27 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X16 128X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.33 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Alternate Memory Width 8
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn60Pb40)

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