S-24CS04ABH vs 93LC66A-E/P feature comparison

S-24CS04ABH ABLIC Inc.

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93LC66A-E/P Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SEIKO INSTRUMENTS USA INC MICROCHIP TECHNOLOGY INC
Package Description SON, DIP, DIP8,.3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 1 MHz
JESD-30 Code R-XDSO-N8 R-PDIP-T8
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 512X8 512X8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code SON DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Serial Bus Type I2C MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code DIP
Pin Count 8
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Data Retention Time-Min 200
Endurance 1000000 Write/Erase Cycles
JESD-609 Code e3
Length 9.27 mm
Number of Ports 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics TOTEM POLE
Package Equivalence Code DIP8,.3
Ready/Busy YES
Reverse Pinout NO
Screening Level TS 16949
Seated Height-Max 5.33 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.002 mA
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Toggle Bit YES
Width 7.62 mm
Write Cycle Time-Max (tWC) 6 ms
Write Protection SOFTWARE

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