RTW30D1210D30R9-RG70
vs
RP73F2E30R9DTG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TAITRON COMPONENTS INC
|
TE CONNECTIVITY LTD
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.21.00.30
|
|
| Construction |
Rectangular
|
Chip
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.55 mm
|
0.55 mm
|
| Package Length |
3.1 mm
|
3.1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.4 mm
|
2.4 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
BULK
|
| Rated Power Dissipation (P) |
0.333 W
|
0.3 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
30.9 Ω
|
30.9 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1210
|
1210
|
| Surface Mount |
YES
|
YES
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
25 ppm/°C
|
25 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
HIGH PRECISION
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Reference Standard |
|
MIL-STD-202
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare RTW30D1210D30R9-RG70 with alternatives
Compare RP73F2E30R9DTG with alternatives