RTW30D1206B2743-RG70 vs RP73F2B274KATDG feature comparison

RTW30D1206B2743-RG70 Taitron Components Inc

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RP73F2B274KATDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TAITRON COMPONENTS INC TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.333 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 274000 Ω 274000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Tolerance 0.1% 0.05%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73
Terminal Shape WRAPAROUND

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Compare RP73F2B274KATDG with alternatives