RTSX72SU-CQ208E
vs
RTSX72SU-1CQ256EV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
CERAMIC, QFP-208
CERAMIC, QFP-256
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
72000 TYPICAL GATES AVAILABLE
72000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
310 MHz
310 MHz
Combinatorial Delay of a CLB-Max
1.4 ns
1.2 ns
JESD-30 Code
S-CQFP-F208
S-CQFP-F256
Length
29.21 mm
36 mm
Number of CLBs
6036
6036
Number of Equivalent Gates
108000
108000
Number of Inputs
360
212
Number of Logic Cells
6036
6036
Number of Outputs
360
212
Number of Terminals
208
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
6036 CLBS, 108000 GATES
6036 CLBS, 108000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HGQFF
HGQFF
Package Equivalence Code
TPAK208,2.9SQ,20
TPAK256,3SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, GUARD RING
FLATPACK, HEAT SINK/SLUG, GUARD RING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-PRF-38535 Class V
Seated Height-Max
3.3 mm
3.3 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
29.21 mm
36 mm
Base Number Matches
2
1
Factory Lead Time
24 Weeks
Total Dose
100k Rad(Si) V
Compare RTSX72SU-CQ208E with alternatives
Compare RTSX72SU-1CQ256EV with alternatives