RTPXA320B2C624-640
vs
IBM25PPC405GPR3DB400
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MARVELL SEMICONDUCTOR INC
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
VFBGA,
BGA, BGA456,26X26,40
Pin Count
456
456
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Boundary Scan
YES
YES
Clock Frequency-Max
13.002 MHz
66.66 MHz
External Data Bus Width
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
Length
14 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
456
456
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY
Seated Height-Max
1 mm
2.21 mm
Speed
624 MHz
400 MHz
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
ECCN Code
3A991.A.2
Bit Size
32
Package Equivalence Code
BGA456,26X26,40
Qualification Status
Not Qualified
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Compare RTPXA320B2C624-640 with alternatives
Compare IBM25PPC405GPR3DB400 with alternatives