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RS10K6651FC vs 201007F6651BD feature comparison

RS10K6651FC Fenghua (HK) Electronics Ltd

Buy Now Datasheet

201007F6651BD Royal Electronic Factory (Thailand) Co Ltd

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction RECTANGULAR PACKAGE Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Resistance 6650 Ω 6650 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(3/4WS,F TOL)
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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