RS06K2103FBL
vs
MC1206P-2103-FBQ
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FENGHUA ADVANCED TECHNOLOGY
RCD COMPONENTS INC
Package Description
CHIP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
RECTANGULAR PACKAGE
Chip
JESD-609 Code
e3
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.61 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.55 mm
Packing Method
Bulk
Bulk
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
Resistance
210000 Ω
210000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Compare RS06K2103FBL with alternatives
Compare MC1206P-2103-FBQ with alternatives