RS06K2103FBL vs MC1206P-2103-FBQ feature comparison

RS06K2103FBL Fenghua (HK) Electronics Ltd

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MC1206P-2103-FBQ RCD Components Inc

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY RCD COMPONENTS INC
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction RECTANGULAR PACKAGE Chip
JESD-609 Code e3 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.61 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.55 mm
Packing Method Bulk Bulk
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 210000 Ω 210000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare RS06K2103FBL with alternatives

Compare MC1206P-2103-FBQ with alternatives