RS03K2610FB vs MC0603P-2610-FBW feature comparison

RS03K2610FB Fenghua (HK) Electronics Ltd

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MC0603P-2610-FBW RCD Components Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY RCD COMPONENTS INC
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code unknown compliant
Construction RECTANGULAR PACKAGE Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.4 mm 0.4 mm
Package Length 1.6 mm 1.55 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method Bulk BULK
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C 70 °C
Resistance 261 Ω 261 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION

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