RS-06K75R0FT
vs
MC1206L6F75R0SE
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FENGHUA ADVANCED TECHNOLOGY
|
SPC TECHNOLOGY/ MULTICOMP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Construction |
Chip
|
Multilayer Chip
|
| JESD-609 Code |
e3
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.55 mm
|
0.55 mm
|
| Package Length |
3.2 mm
|
3.1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.6 mm
|
1.55 mm
|
| Packing Method |
TR
|
TR, Paper
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Resistance |
75 Ω
|
75 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare RS-06K75R0FT with alternatives
Compare MC1206L6F75R0SE with alternatives